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Qualcomm B39881B8209P810
Part No:
B39881B8209P810
Manufacturer:
Datasheet:
Package:
-
AINNX NO:
34459234-B39881B8209P810
Category:
Description:
Qualcomm HQTCF CSSP3 DPLX CU
Products specifications
- Factory Pack QuantityFactory Pack Quantity5000
- ManufacturerQualcomm RF360
- BrandRF360
- RoHSDetails
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Reel - Product Category
a particular group of related products.
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