Mounting Type
Surface Mount
Package / Case
TO-236-3, SC-59, SOT-23-3
Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES
Diode Element Material
SILICON
Number of Elements
2
Power Dissipation (Max)
0.35W
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR)
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Last Time Buy
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
3
Terminal Finish
MATTE TIN
Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
ULTRA FAST
Terminal Position
DUAL
Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
GULL WING
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
unknown
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Pin Count
a count of all of the component leads (or pins)
3
JESD-30 Code
R-PDSO-G3
Qualification Status
An indicator of formal certification of qualifications.
COMMERCIAL
Speed
Small Signal =< 200mA (Io), Any Speed
Diode Type
Standard
Current - Reverse Leakage @ Vr
5μA @ 70V
Voltage - Forward (Vf) (Max) @ If
1.25V @ 150mA
Operating Temperature - Junction
150°C Max
Output Current-Max
0.2A
Voltage - DC Reverse (Vr) (Max)
70V
Current - Average Rectified (Io)
200mA
Reverse Recovery Time
6ns
Rep Pk Reverse Voltage-Max
70V
Diode Configuration
1 Pair Common Cathode
RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
ROHS3 Compliant