Rochester Electronics, LLC MBR2535CT

Mounting Type

Through Hole

Package / Case

TO-220-3

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Diode Element Material

SILICON

Number of Elements

2

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Series

SWITCHMODE™

JESD-609 Code

e0

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

Terminal Finish

TIN LEAD

Applications

POWER

Terminal Position

SINGLE

Peak Reflow Temperature (Cel)

240

Reach Compliance Code

unknown

Time@Peak Reflow Temperature-Max (s)

30

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PSFM-T3

Qualification Status

An indicator of formal certification of qualifications.

COMMERCIAL

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type

Schottky

Current - Reverse Leakage @ Vr

200μA @ 35V

Voltage - Forward (Vf) (Max) @ If

820mV @ 30A

Operating Temperature - Junction

-65°C~175°C

Output Current-Max

30A

Voltage - DC Reverse (Vr) (Max)

35V

Current - Average Rectified (Io)

30A

Number of Phases

1

Rep Pk Reverse Voltage-Max

35V

JEDEC-95 Code

TO-220AB

Non-rep Pk Forward Current-Max

150A

Diode Configuration

1 Pair Common Cathode

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant