Rochester Electronics LLC DS26401

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

256

Rohs Code

No

Part Life Cycle Code

Active

Ihs Manufacturer

ROCHESTER ELECTRONICS INC

Part Package Code

BGA

Package Description

BGA,

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

SQUARE

Package Style

GRID ARRAY

Supply Voltage-Nom

3.3 V

JESD-609 Code

e0

Pbfree Code

No

Terminal Finish

TIN LEAD

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

245

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

unknown

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

a count of all of the component leads (or pins)

256

JESD-30 Code

S-PBGA-B256

Qualification Status

An indicator of formal certification of qualifications.

COMMERCIAL

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

COMMERCIAL

Seated Height-Max

1.77 mm

Telecom IC Type

FRAMER

Saturation Current

NOT SPECIFIED

Length

17 mm

Width

17 mm