ROHM Semiconductor DTC114EKAT146

Factory Lead Time

13 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Number of Pins

3

Collector-Emitter Breakdown Voltage

50V

Number of Elements

1

hFEMin

30

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2006

JESD-609 Code

e1

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

Termination

SMD/SMT

ECCN Code

EAR99

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150°C

Min Operating Temperature

-55°C

Voltage - Rated DC

50V

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

200mW

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

50mA

Time@Peak Reflow Temperature-Max (s)

10

Base Part Number

DTC114

Pin Count

a count of all of the component leads (or pins)

3

Max Output Current

The maximum current that can be supplied to the load.

100mA

Operating Supply Voltage

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

50V

Polarity

NPN

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

200mW

Transistor Application

SWITCHING

Gain Bandwidth Product

The gain–bandwidth product (designated as GBWP, GBW, GBP, or GB) for an amplifier is the product of the amplifier's bandwidth and the gain at which the bandwidth is measured.

250MHz

Transistor Type

NPN - Pre-Biased

Collector Emitter Voltage (VCEO)

300mV

Max Collector Current

100mA

DC Current Gain (hFE) (Min) @ Ic, Vce

30 @ 5mA 5V

Current - Collector Cutoff (Max)

500nA

Vce Saturation (Max) @ Ib, Ic

300mV @ 500μA, 10mA

Transition Frequency

250MHz

Max Breakdown Voltage

50V

Max Junction Temperature (Tj)

150°C

Resistor - Base (R1)

10 k Ω

Continuous Collector Current

50mA

Resistor - Emitter Base (R2)

10 k Ω

Height

1.3mm

Length

2.9mm

Width

1.6mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free