STL65DN3LLH5

STMicroelectronics STL65DN3LLH5

Part No:

STL65DN3LLH5

Manufacturer:

STMicroelectronics

Datasheet:

STL65DN3LLH5

Package:

8-PowerVDFN

ROHS:

AINNX NO:

6820769-STL65DN3LLH5

Description:

Dual N-Channel 30 V 0.0065 Ohm SMT STripFET V Power MosFet - PowerFLAT 5x6

Products specifications
  • Lifecycle Status
    OBSOLETE (Last Updated: 7 months ago)
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    8-PowerVDFN
  • Number of Pins
    8
  • Transistor Element Material
    SILICON
  • Memory Types
    FLASH
  • Number of Elements
    2
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C~150°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series
    STripFET™ V
  • JESD-609 Code
    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    6
  • ECCN Code
    EAR99
  • Resistance
    6.5MOhm
  • Terminal Finish
    Matte Tin (Sn)
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    60W
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    STL65
  • Pin Count

    a count of all of the component leads (or pins)

    8
  • JESD-30 Code
    R-PDSO-N6
  • Interface
    CAN, I2C, I2S, SPI, UART, USART, USB
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    768kB
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Dual
  • RAM Size
    132kB
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ENHANCEMENT MODE
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    60W
  • Case Connection
    DRAIN
  • Data Bus Width
    32b
  • FET Type
    2 N-Channel (Dual)
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    6.5m Ω @ 9.5A, 10V
  • Vgs(th) (Max) @ Id
    1.5V @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds
    1500pF @ 25V
  • Gate Charge (Qg) (Max) @ Vgs
    12nC @ 4.5V
  • Number of Timers/Counters
    14
  • Continuous Drain Current (ID)
    65A
  • Gate to Source Voltage (Vgs)
    22V
  • Core Architecture
    ARM
  • Max Frequency
    120MHz
  • Drain Current-Max (Abs) (ID)
    19A
  • Drain to Source Breakdown Voltage
    30V
  • Pulsed Drain Current-Max (IDM)
    76A
  • Number of Programmable I/O
    114
  • FET Technology
    METAL-OXIDE SEMICONDUCTOR
  • FET Feature
    Logic Level Gate
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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