STMicroelectronics STS10DN3LH5

Lifecycle Status

NRND (Last Updated: 8 months ago)

Factory Lead Time

14 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

8-SOIC (0.154, 3.90mm Width)

Number of Pins

8

Transistor Element Material

SILICON

Number of Elements

2

Turn Off Delay Time

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

13 ns

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C~150°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

STripFET™ V

JESD-609 Code

e4

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

8

ECCN Code

EAR99

Resistance

21MOhm

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au)

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

2.5W

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30

Base Part Number

STS10

Pin Count

a count of all of the component leads (or pins)

8

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

2.5W

Turn On Delay Time

Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

4 ns

FET Type

2 N-Channel (Dual)

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

21m Ω @ 5A, 10V

Vgs(th) (Max) @ Id

1V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

475pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

4.6nC @ 5V

Rise Time

In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

22ns

Drain to Source Voltage (Vdss)

30V

Fall Time (Typ)

2.8 ns

Continuous Drain Current (ID)

10A

Gate to Source Voltage (Vgs)

22V

Drain to Source Breakdown Voltage

30V

Pulsed Drain Current-Max (IDM)

40A

Avalanche Energy Rating (Eas)

50 mJ

FET Technology

METAL-OXIDE SEMICONDUCTOR

FET Feature

Logic Level Gate

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free