TDK Corporation FFE1070MS10RBL

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

3-SIP, 2.50mm pitch

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Box (TB)

Series

FFE

Published

2001

Size / Dimension

0.315Lx0.157W 8.00mmx4.00mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

Not Applicable

Termination

Radial

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

85°C

Min Operating Temperature

-40°C

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

AMMO PACK

Reach Compliance Code

unknown

Frequency

10.7MHz Center

Physical Dimension

L8.0XB4.0XH7.0 (mm)/L0.315XB0.157XH0.276 (inch)

Filter Type

Band Pass

Insertion Loss (dB)

7 dB

Height

7.0104mm

Length

8mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant