TDK Corporation PFC3519QM-301K06B-00

Lifecycle Status

PRODUCTION (NOT RECOMMENDED FOR NEW DESIGN) (Last Updated: 1 month ago)

Factory Lead Time

10 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Terminal Shape

WIRE

Shape/Size Description

RECTANGULAR PACKAGE

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

FERRITE

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

PFC

Published

2013

Size / Dimension

1.181Lx1.457W 30.00mmx37.00mm

Tolerance

10%

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Not For New Designs

Moisture Sensitivity Level (MSL)

1 (Unlimited)

ECCN Code

EAR99

Shielding

NO

Number of Functions

2

Reach Compliance Code

unknown

Inductance

300μH

Test Frequency

a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.

0.05MHz

Current

5.5A

Inductor Application

HIGH CURRENT INDUCTOR

Terminal Placement

DUAL IN-LINE

Inductor Type

GENERAL PURPOSE INDUCTOR

Number of Lines

4

Height

19.9898mm

Height Seated (Max)

0.787 20.00mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant