TDK Corporation YFF21PC1E474M

Mount

Through Hole

Mounting Type

Surface Mount

Package / Case

0805 (2012 Metric), 4 PC Pad

Weight

5.499807mg

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

YFF-P

Published

2012

Size / Dimension

0.079Lx0.049W 2.00mmx1.25mm

Tolerance

±20%

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

SMD/SMT

ECCN Code

EAR99

Terminal Finish

Tin (Sn)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

125°C

Min Operating Temperature

-55°C

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8504.50.80.00

Capacitance

0.47μF

Voltage - Rated DC

25V

Number of Functions

1

Case Code (Metric)

2012

Case Code (Imperial)

0805

Physical Dimension

L2.0XB1.25XH0.85 (mm)/L0.079XB0.049XH0.033 (inch)

Voltage

25V

DC Resistance (DCR)

30mOhm

Current

2A

Filter Type

FERRITE CHIP

Height

990.6μm

Length

2mm

Width

1.25mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant