TDK-Epcos B82731X0002

Mounting Type

Through Hole

Packages Included

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Series

B82731T

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Plastic Box with Bin Guide

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Quantity

Assorted

Kit Type

Common Mode Chokes for Power Lines