TDK-Epcos B82733X0001

Mounting Type

Through Hole

Packages Included

Horizontal, 4 PC Pin

Package

Book

Mfr

EPCOS - TDK Electronics

Product Status

Obsolete

Series

B82733F

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Plastic Box with Bin Guide

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Quantity

Assorted

Kit Type

Common Mode Chokes for Power Lines