THGBMNG5D1LBAIT

Toshiba America Electronic Components THGBMNG5D1LBAIT

Part No:

THGBMNG5D1LBAIT

Package:

-

AINNX NO:

68718932-THGBMNG5D1LBAIT

Description:

Description: Flash, 4GX8, PBGA153

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Material
    polyethylene
  • Number of Terminals
    153
  • Part Life Cycle Code
    Transferred
  • Ihs Manufacturer
    TOSHIBA CORP
  • Package Description
    WFBGA-153
  • Date Of Intro
    2019-01-21
  • Number of Words
    4294967296 words
  • Number of Words Code
    4000000000
  • Operating Temperature-Max
    85 °C
  • Operating Temperature-Min
    -25 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY
  • Transport packaging size / quantity
    48*31.5*22/15000
  • Additionally
    with a red stripe
  • ECCN Code
    EAR99
  • Type
    PE bag with zip lock
  • Color
    transparent
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.51
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Number of Functions
    1
  • Reach Compliance Code
    unknown
  • JESD-30 Code
    R-PBGA-B153
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    OTHER
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ASYNCHRONOUS
  • Organization
    4GX8
  • Memory Width
    8
  • Memory Density
    34359738368 bit
  • Parallel/Serial
    SERIAL
  • Memory IC Type
    FLASH
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    2.7 V
  • Features
    zip-lock
  • Width
    100 mm
  • Thickness
    45 μm
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