TLP700A(F)

Toshiba Semiconductor and Storage TLP700A(F)

Part No:

TLP700A(F)

Datasheet:

TLP700A

Package:

6-SOIC (0.268, 6.80mm Width)

ROHS:

AINNX NO:

1523775-TLP700A(F)

Description:

Optocoupler Logic-Out Totem-Pole DC-IN 1-CH 6-Pin SDIP SMD

Products specifications
  • Factory Lead Time
    12 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    6-SOIC (0.268, 6.80mm Width)
  • Number of Pins
    6
  • Number of Elements
    1
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~110°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Published
    2012
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    160mW
  • Supply Voltage
    30V
  • Approval Agency
    cUR, UR, VDE
  • Voltage - Isolation
    5000Vrms
  • Max Output Current

    The maximum current that can be supplied to the load.

    2.5A
  • Number of Channels
    1
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    160mW
  • Voltage - Forward (Vf) (Typ)
    1.55V
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    200 ns
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    200 ns
  • Optoelectronic Device Type
    LOGIC IC OUTPUT OPTOCOUPLER
  • Forward Current

    Current which flows upon application of forward voltage.

    10mA
  • Response Time

    the time taken for a circuit or measuring device, when subjected to a change in input signal, to change its state by a specified fraction of its total response to that change.

    2e-7 ns
  • Direction
    Unidirectional
  • Rise Time

    In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

    15ns
  • Fall Time (Typ)
    8 ns
  • Rise / Fall Time (Typ)
    15ns 8ns
  • Reverse Breakdown Voltage
    5V
  • Current - DC Forward (If) (Max)
    20mA
  • Propagation Delay tpLH / tpHL (Max)
    200ns, 200ns
  • Common Mode Transient Immunity (Min)
    20kV/μs
  • Pulse Width Distortion (Max)
    50ns
  • Voltage - Output Supply
    15V~30V
  • REACH SVHC
    Unknown
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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