Xilinx Inc. XC7Z035-1FBG676C

Factory Lead Time

10 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Copper, Silver, Tin

Mount

Surface Mount

Package / Case

676-BBGA, FCBGA

Number of I/Os

130

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

0°C~85°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

Zynq®-7000

Published

2010

JESD-609 Code

e1

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

676

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Supply Voltage

1V

Frequency

667MHz

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

JESD-30 Code

S-PBGA-B676

Interface

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

Max Supply Voltage

In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

1.05V

Min Supply Voltage

The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

950mV

RAM Size

256KB

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripherals

DMA

Propagation Delay

the flight time of packets over the transmission link and is limited by the speed of light.

120 ps

Connectivity

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture

MCU, FPGA

Core Architecture

ARM

Boundary Scan

YES

Speed Grade

1

RAM (words)

256000

Primary Attributes

Kintex™-7 FPGA, 275K Logic Cells

Number of Registers

343800

Bus Compatibility

CAN; ETHERNET; I2C; SPI; UART; USB

Length

27mm

Height Seated (Max)

2.54mm

Width

27mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant