XMOS XS1-U10A-128-FB217-I10

Factory Lead Time

12 Weeks

Mounting Type

Surface Mount

Package / Case

217-LFBGA

Number of Pins

217

Data Converters

A/D 8x12b

Number of I/Os

73

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

XS1

Published

2014

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Frequency

500MHz

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

128kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

128kB

Voltage - Supply (Vcc/Vdd)

3V~3.6V

Core Processor

XCore

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

SRAM

Core Size

32-Bit 10-Core

Program Memory Size

128KB 32K x 32

Connectivity

Configurable

Speed Grade

1000 MIPS

REACH SVHC

Unknown

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant