XS1-U8A-64-FB96-C5

XMOS XS1-U8A-64-FB96-C5

Part No:

XS1-U8A-64-FB96-C5

Manufacturer:

XMOS

Package:

96-LFBGA

ROHS:

AINNX NO:

4811051-XS1-U8A-64-FB96-C5

Description:

IC MCU 32BIT 64KB SRAM 96FBGA

Products specifications
  • Factory Lead Time
    12 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    96-LFBGA
  • Number of Pins
    96
  • Supplier Device Package
    96-FBGA (10x10)
  • Data Converters
    A/D 4x12b
  • Memory Types
    RAM
  • Number of I/Os
    38
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    XS1
  • Published
    2005
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    70°C
  • Min Operating Temperature
    0°C
  • Frequency
    500MHz
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    1.05V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    950mV
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    64kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • Speed
    500MIPS
  • RAM Size
    64kB
  • Voltage - Supply (Vcc/Vdd)
    3V~3.6V
  • Core Processor
    XCore
  • Peripherals
    PWM
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    SRAM
  • Core Size
    32-Bit 8-Core
  • Program Memory Size
    64KB 16K x 32
  • Connectivity
    Configurable
  • Core Architecture
    XCore
  • Speed Grade
    500 MIPS
  • REACH SVHC
    Unknown
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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