ANBON SEMICONDUCTOR (INT'L) LIMITED US1D-A

Mounting Type

Surface Mount

Package / Case

DO-214AC, SMA

Supplier Device Package

DO-214AC (SMA)

Mfr

ANBON SEMICONDUCTOR (INT''L) LIMITED

Base Product Number

US1D

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Current - Reverse Leakage @ Vr

5 µA @ 200 V

Voltage - Forward (Vf) (Max) @ If

1 V @ 1 A

Operating Temperature - Junction

-55°C ~ 150°C

Voltage - DC Reverse (Vr) (Max)

200 V

Current - Average Rectified (Io)

1A

Capacitance @ Vr, F

15pF @ 4V, 1MHz

Reverse Recovery Time (trr)

50 ns