EIC SEMICONDUCTOR INC. ESJA04-03A

Mounting Type

Through Hole

Package / Case

Axial

Supplier Device Package

M1A

Mfr

EIC SEMICONDUCTOR INC.

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bag

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Speed

Small Signal =< 200mA (Io), Any Speed

Current - Reverse Leakage @ Vr

2 µA @ 3000 V

Voltage - Forward (Vf) (Max) @ If

12 V @ 10 mA

Operating Temperature - Junction

120°C (Max)

Voltage - DC Reverse (Vr) (Max)

3000 V

Current - Average Rectified (Io)

1mA

Reverse Recovery Time (trr)

80 ns