ESJA04-03A

EIC SEMICONDUCTOR INC. ESJA04-03A

Part No:

ESJA04-03A

Datasheet:

ESJA04-03A.pdf

Package:

Axial

AINNX NO:

69475955-ESJA04-03A

Description:

DIODE GEN PURP 3KV 1MA M1A

Products specifications
  • Mounting Type
    Through Hole
  • Package / Case
    Axial
  • Supplier Device Package
    M1A
  • Mfr
    EIC SEMICONDUCTOR INC.
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bag
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Speed
    Small Signal =< 200mA (Io), Any Speed
  • Current - Reverse Leakage @ Vr
    2 µA @ 3000 V
  • Voltage - Forward (Vf) (Max) @ If
    12 V @ 10 mA
  • Operating Temperature - Junction
    120°C (Max)
  • Voltage - DC Reverse (Vr) (Max)
    3000 V
  • Current - Average Rectified (Io)
    1mA
  • Reverse Recovery Time (trr)
    80 ns
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