EIC SEMICONDUCTOR INC. BYV96E T/R

Mounting Type

Through Hole

Package / Case

DO-204AC, DO-15, Axial

Supplier Device Package

DO-15

Mfr

EIC SEMICONDUCTOR INC.

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Current - Reverse Leakage @ Vr

5 µA @ 1000 V

Voltage - Forward (Vf) (Max) @ If

1.6 V @ 1.5 A

Operating Temperature - Junction

175°C

Voltage - DC Reverse (Vr) (Max)

1000 V

Current - Average Rectified (Io)

1.5A

Reverse Recovery Time (trr)

300 ns