EU RoHS
Compliant with Exemption
ECCN (US)
EAR99
HTS
8541.29.00.95
SVHC
Yes
Automotive
No
PPAP
No
Category
Power MOSFET
Channel Mode
Enhancement
Number of Elements per Chip
1
Maximum Drain Source Voltage (V)
30
Maximum Gate Source Voltage (V)
±20
Maximum Continuous Drain Current (A)
150
Typical Gate Charge @ Vgs (nC)
38@10V
Typical Gate Charge @ 10V (nC)
38
Typical Input Capacitance @ Vds (pF)
5000@25V
Maximum Power Dissipation (mW)
130000
Typical Fall Time (ns)
39
Typical Rise Time (ns)
24
Typical Turn-Off Delay Time (ns)
91
Typical Turn-On Delay Time (ns)
26
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
175
Supplier Temperature Grade
Commercial
Mounting
Through Hole
Package Height
8.7
Package Width
4.5
Package Length
10.1
PCB changed
3
Tab
Tab
Supplier Package
TO-220AB
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tube
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active
Pin Count
a count of all of the component leads (or pins)
3
Configuration
Single
Channel Type
N