GS8672D18BE-333I

GSI Technology GS8672D18BE-333I

Part No:

GS8672D18BE-333I

Manufacturer:

GSI Technology

Datasheet:

-

Package:

BGA-165

AINNX NO:

28935462-GS8672D18BE-333I

Category:

Memory

Description:

Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165

Products specifications
  • Factory Lead Time
    12 Weeks
  • Package / Case
    BGA-165
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    165
  • Moisture Sensitive
    Yes
  • Maximum Clock Frequency
    333 MHz
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 85 C
  • Supply Voltage-Max
    1.9 V
  • Minimum Operating Temperature
    - 40 C
  • Factory Pack QuantityFactory Pack Quantity
    15
  • Supply Voltage-Min
    1.7 V
  • Mounting Styles
    SMD/SMT
  • Interface Type
    Parallel
  • Manufacturer
    GSI Technology
  • Brand
    GSI Technology
  • Tradename
    SigmaQuad-II
  • Memory Types
    QDR-II
  • Package Description
    LBGA, BGA165,11X15,40
  • Package Style
    GRID ARRAY, LOW PROFILE
  • Number of Words Code
    4000000
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA165,11X15,40
  • Operating Temperature-Min
    -40 °C
  • Access Time-Max
    0.45 ns
  • Operating Temperature-Max
    85 °C
  • Rohs Code
    No
  • Manufacturer Part Number
    GS8672D18BE-333I
  • Clock Frequency-Max (fCLK)
    333 MHz
  • Number of Words
    4194304 words
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Package Code
    LBGA
  • Package Shape
    RECTANGULAR
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    GSI TECHNOLOGY
  • Risk Rank
    5.43
  • Part Package Code
    BGA
  • Series
    GS8672D18BE
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • ECCN Code
    3A991.B.2.B
  • Type
    SigmaQuad-II
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    PIPELINE ARCHITECTURE
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.41
  • Subcategory
    Memory & Data Storage
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    1 mm
  • Reach Compliance Code
    compliant
  • Pin Count

    a count of all of the component leads (or pins)

    165
  • JESD-30 Code
    R-PBGA-B165
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.9 V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    1.5/1.8,1.8 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    72 Mbit
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Supply Current-Max
    1.21 A
  • Organization
    4 M x 18
  • Output Characteristics
    3-STATE
  • Seated Height-Max
    1.5 mm
  • Memory Width
    18
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    SRAM
  • Memory Density
    72
  • Parallel/Serial
    PARALLEL
  • I/O Type
    SEPARATE
  • Memory IC Type
    STANDARD SRAM
  • Standby Voltage-Min
    1.7 V
  • Product Category

    a particular group of related products.

    SRAM
  • Width
    15 mm
  • Length
    17 mm
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