GS8672D18BE-400I
BGA-165
29428382-GS8672D18BE-400I
Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165
the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
The memory capacity is the amount of data a device can store at any given time in its memory.
a group of products which fulfill a similar need for a market segment or market as a whole.
a particular group of related products.