GS88018CGT-150I

GSI Technology GS88018CGT-150I

Part No:

GS88018CGT-150I

Manufacturer:

GSI Technology

Datasheet:

-

Package:

TQFP-100

AINNX NO:

28969612-GS88018CGT-150I

Category:

Memory

Description:

Cache SRAM, 512KX18, 7.5ns, CMOS, PQFP100, ROHS COMPLIANT, TQFP-100

Products specifications
  • Factory Lead Time
    8 Weeks
  • Package / Case
    TQFP-100
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    100
  • Moisture Sensitive
    Yes
  • Maximum Clock Frequency
    150 MHz
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 85 C
  • Supply Voltage-Max
    3.6 V
  • Minimum Operating Temperature
    - 40 C
  • Factory Pack QuantityFactory Pack Quantity
    72
  • Supply Voltage-Min
    2.3 V
  • Mounting Styles
    SMD/SMT
  • Interface Type
    Parallel
  • Manufacturer
    GSI Technology
  • Brand
    GSI Technology
  • Tradename
    SyncBurst
  • RoHS
    Details
  • Memory Types
    SDR
  • Package Description
    LQFP, QFP100,.63X.87
  • Package Style
    FLATPACK, LOW PROFILE
  • Moisture Sensitivity Levels
    3
  • Number of Words Code
    512000
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    QFP100,.63X.87
  • Operating Temperature-Min
    -40 °C
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Access Time-Max
    7.5 ns
  • Operating Temperature-Max
    85 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    GS88018CGT-150I
  • Clock Frequency-Max (fCLK)
    150 MHz
  • Number of Words
    524288 words
  • Supply Voltage-Nom (Vsup)
    2.5 V
  • Package Code
    LQFP
  • Package Shape
    RECTANGULAR
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    GSI TECHNOLOGY
  • Risk Rank
    5.3
  • Part Package Code
    QFP
  • Series
    GS88018CGT
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • JESD-609 Code
    e3
  • Pbfree Code
    Yes
  • ECCN Code
    3A991.B.2.B
  • Type
    Pipeline/Flow Through
  • Terminal Finish
    PURE MATTE TIN
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.41
  • Subcategory
    Memory & Data Storage
  • Technology
    CMOS
  • Terminal Position
    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65 mm
  • Reach Compliance Code
    compliant
  • Pin Count

    a count of all of the component leads (or pins)

    100
  • JESD-30 Code
    R-PQFP-G100
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)
    2.7 V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    2.5/3.3 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    2.3 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    9 Mbit
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Supply Current-Max
    140 mA, 150 mA
  • Access Time
    7.5 ns
  • Organization
    512 k x 18
  • Output Characteristics
    3-STATE
  • Seated Height-Max
    1.6 mm
  • Memory Width
    18
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    SRAM
  • Standby Current-Max
    0.045 A
  • Memory Density
    9437184 bit
  • Parallel/Serial
    PARALLEL
  • I/O Type
    COMMON
  • Memory IC Type
    CACHE SRAM
  • Standby Voltage-Min
    2.3 V
  • Product Category

    a particular group of related products.

    SRAM
  • Width
    14 mm
  • Length
    20 mm
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