HEYCO PRODUCTS 10444

Mounting Type

Surface Mount

Material

Nylon 6/6

Mated Stacking Heights

2.5mm, 3mm

Mounting Hole Diameter mm

0.062

Alternate PN

HSP-MDL-1-02M

RoHS

Non-Compliant

Series

IL-312

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Connector Type

Plug, Center Strip Contacts

Type

Metric Spacing

Number of Positions

100

Number of Rows

2

Pitch

0.020 (0.50mm)

Contact Finish

Gold

Product

Supports

Features

Board Guide, Solder Retention

Length

2 mm

Contact Finish Thickness

3.90µin (0.099µm)

Height Above Board

0.061 (1.55mm)