HEYCO PRODUCTS 10446

Lifecycle Status

Production (Last Updated: 1 week ago)

Mount

Axial

Material

Nylon 6/6

Weight

400.011771 mg

Voltage, Rating

350 V

RoHS

Compliant

Mounting Hole Diameter mm

0.062

Alternate PN

HSP-MDL-1-04M

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

0.1 %

Number of Terminations

2

Termination

Axial

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

50 ppm/°C

Type

Metric Spacing

Resistance

178 Ω

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

155 °C

Min Operating Temperature

-55 °C

Composition

Metal Film, Thin Film

Power Rating

500 mW

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

500 mW

ELV

Compliant

Number of Resistors

1

Product

Supports

Length

10 mm

Diameter

3.7 mm