HEYCO PRODUCTS 10445

Mounting Type

Surface Mount

Material

Nylon

Mated Stacking Heights

3mm, 3.5mm

Alternate PN

HSP-MDL-1-03M

Series

IL-312

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Connector Type

Receptacle, Outer Shroud Contacts

Type

Metric Spacing

Number of Positions

100

Number of Rows

2

Pitch

0.020 (0.50mm)

Contact Finish

Gold

Product

Supports

Features

Board Guide, Solder Retention

Length

16 mm

Contact Finish Thickness

3.90µin (0.099µm)

Height Above Board

0.104 (2.65mm)