Infineon Technologies BCV61BE6327HTSA1

Factory Lead Time

4 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-253-4, TO-253AA

Number of Pins

4

Number of Elements

2

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2005

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Last Time Buy

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Terminal Finish

Tin (Sn)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150°C

Min Operating Temperature

-65°C

Applications

Current Mirror

Voltage - Rated DC

30V

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

300mW

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

100mA

Frequency

250MHz

Base Part Number

BCV61

Reference Standard

AEC-Q101

Polarity

NPN

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

300mW

Halogen Free

Not Halogen Free

Transistor Type

2 NPN, Base Collector Junction

Collector Emitter Voltage (VCEO)

5V

Max Collector Current

100mA

Transition Frequency

250MHz

Collector Base Voltage (VCBO)

30V

Emitter Base Voltage (VEBO)

6V

DC Current Gain-Min (hFE)

200

Height

900μm

Length

2.9mm

Width

1.3mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free