IXFM12N100

IXYS Integrated Circuits Division / Littelfuse IXFM12N100

Part No:

IXFM12N100

Datasheet:

-

Package:

-

AINNX NO:

31978148-IXFM12N100

Description:

Products specifications
  • Material
    Si
  • EU RoHS
    Compliant
  • Automotive
    No
  • PPAP
    No
  • Category
    Power MOSFET
  • Process Technology
    HDMOS
  • Channel Mode
    Enhancement
  • Number of Elements per Chip
    1
  • Maximum Drain Source Voltage (V)
    1000
  • Maximum Gate Source Voltage (V)
    ±20
  • Maximum Continuous Drain Current (A)
    12
  • Typical Gate Charge @ Vgs (nC)
    122@10V
  • Typical Gate Charge @ 10V (nC)
    122
  • Typical Input Capacitance @ Vds (pF)
    4000@25V
  • Maximum Power Dissipation (mW)
    300000
  • Typical Fall Time (ns)
    32
  • Typical Rise Time (ns)
    33
  • Typical Turn-Off Delay Time (ns)
    62
  • Typical Turn-On Delay Time (ns)
    21
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Mounting
    Through Hole
  • Package Height
    11.4(Max)
  • Package Width
    26.66
  • Package Length
    30.15 + 9.54(Max)
  • PCB changed
    2
  • Tab
    Tab
  • Supplier Package
    TO-204AA
  • RoHS
    Compliant
  • Turn Off Delay Time

    It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

    62 ns
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    150 °C
  • Min Operating Temperature
    -55 °C
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • Configuration
    Single
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Single
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    300 W
  • Rise Time

    In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

    33 ns
  • Continuous Drain Current (ID)
    12 A
  • Gate to Source Voltage (Vgs)
    20 V
  • Drain to Source Breakdown Voltage
    1 kV
  • Channel Type
    N
  • Drain to Source Resistance
    1.05 Ω
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