TSM3911DCX6 RFG

Taiwan Semiconductor Corporation TSM3911DCX6 RFG

Part No:

TSM3911DCX6 RFG

Datasheet:

TSM3911D

Package:

SOT-23-6

ROHS:

AINNX NO:

6378401-TSM3911DCX6 RFG

Description:

MOSFET 2 P-CH 20V 2.2A SOT26

Products specifications
  • Factory Lead Time
    20 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    SOT-23-6
  • Current - Continuous Drain (Id) @ 25℃
    2.2A Ta
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C~150°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Digi-Reel®
  • Published
    2015
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Power - Max
    1.15W
  • FET Type
    2 P-Channel (Dual)
  • Rds On (Max) @ Id, Vgs
    140m Ω @ 2.2A, 4.5V
  • Vgs(th) (Max) @ Id
    950mV @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds
    882.51pF @ 6V
  • Gate Charge (Qg) (Max) @ Vgs
    15.23nC @ 4.5V
  • Drain to Source Voltage (Vdss)
    20V
  • FET Feature
    Standard
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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