Toshiba 3SK126-Y(TE85L,F)

Material

Si

ECCN (US)

EAR99

Channel Mode

Depletion

Number of Elements per Chip

1

Maximum Drain Source Voltage (V)

15

Maximum Gate Source Voltage (V)

±9

Maximum Continuous Drain Current (A)

0.03

Typical Input Capacitance @ Vds (pF)

4.25@6V

Maximum Power Dissipation (mW)

150

Typical Power Gain (dB)

25

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Supplier Package

2-3J1A

Military

No

Mounting

Surface Mount

Package Height

1.1

Package Length

2.9

Package Width

1.5

PCB changed

3

Tab

Tab

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

4

Configuration

Single Dual Gate

Channel Type

N

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant