Toshiba Semiconductor and Storage 3SK291(TE85L,F)

Factory Lead Time

52 Weeks

Package / Case

SC-61AA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

4

Operating Temperature (Max.)

125°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Published

2009

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

150mW

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

30mA

Frequency

800MHz

Configuration

Single

Current - Test

10mA

Drain to Source Voltage (Vdss)

12.5V

Transistor Type

N-Channel Dual Gate

Continuous Drain Current (ID)

30mA

Gain

22.5dB

Drain Current-Max (Abs) (ID)

0.03A

FET Technology

METAL-OXIDE SEMICONDUCTOR

Noise Figure

Noise figure (NF) and noise factor (F) are measures of degradation of the signal-to-noise ratio (SNR), caused by components in a signal chain.

2.5dB

Voltage - Test

6V

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant