Toshiba Semiconductor and Storage 2SK3078A(TE12L,F)

Mount

Surface Mount

Package / Case

TO-243AA

Number of Pins

3

Number of Elements

1

Usage Level

Automotive grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Published

2007

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

ECCN Code

EAR99

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150°C

Min Operating Temperature

-45°C

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

3W

Reach Compliance Code

unknown

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

500mA

Frequency

470MHz

Current - Test

50mA

Drain to Source Voltage (Vdss)

10V

Transistor Type

N-Channel

Continuous Drain Current (ID)

500mA

Gate to Source Voltage (Vgs)

5V

Gain

8dB

Power - Output

28dbm

Voltage - Test

4.5V

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant