XS1-L02A-QF124-C5-THS

XMOS XS1-L02A-QF124-C5-THS

Part No:

XS1-L02A-QF124-C5-THS

Manufacturer:

XMOS

Package:

124-TFQFN Dual Rows, Exposed Pad

ROHS:

AINNX NO:

4913572-XS1-L02A-QF124-C5-THS

Description:

IC MCU 32BIT 128KB SRAM 124QFN

Products specifications
  • Factory Lead Time
    12 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    124-TFQFN Dual Rows, Exposed Pad
  • Supplier Device Package
    124-QFN DualRow (10x10)
  • Memory Types
    SRAM
  • Number of I/Os
    84
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~70°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    XS1
  • Published
    2010
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    70°C
  • Min Operating Temperature
    0°C
  • Interface
    USB
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    128kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    External
  • Speed
    500MIPS
  • Voltage - Supply (Vcc/Vdd)
    0.95V~3.6V
  • Core Processor
    XCore
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    SRAM
  • Core Size
    32-Bit Dual-Core
  • Program Memory Size
    128KB 32K x 32
  • Connectivity
    Configurable
  • Core Architecture
    XCore
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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