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GSI Technology GS816136DD-150
GS816136DD-150
BGA-165
29763888-GS816136DD-150
Cache SRAM, 512KX36, 7.5ns, CMOS, PBGA165, FPBGA-165
- Package / CaseBGA-165
- Moisture SensitiveYes
- Maximum Clock Frequency150 MHz
- Maximum Operating Temperature
the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
+ 70 C - Supply Voltage-Max3.6 V
- Minimum Operating Temperature0 C
- Factory Pack QuantityFactory Pack Quantity36
- Supply Voltage-Min2.3 V
- Mounting StylesSMD/SMT
- Interface TypeParallel
- ManufacturerGSI Technology
- BrandGSI Technology
- TradenameSyncBurst
- RoHSN
- Memory TypesSDR
- SeriesGS816136DD
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - TypePipeline/Flow Through
- SubcategoryMemory & Data Storage
- Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
18 Mbit - Supply Current-Max180 mA, 190 mA
- Access Time7.5 ns
- Organization512 k x 36
- Product Type
a group of products which fulfill a similar need for a market segment or market as a whole.
SRAM - Product Category
a particular group of related products.
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