Taiwan Semiconductor Corporation TSG65N068CE RVG

Mfr

Taiwan Semiconductor Corporation

Base Product Number

TSG65

Series

*

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active