W25Q32JVZEIQ TR

Winbond Electronics Corporation W25Q32JVZEIQ TR

Part No:

W25Q32JVZEIQ TR

Datasheet:

-

Package:

-

AINNX NO:

31954389-W25Q32JVZEIQ TR

Description:

Products specifications
  • EU RoHS
    Compliant
  • HTS
    8542.32.00.71
  • Automotive
    No
  • PPAP
    No
  • Chip Density (bit)
    32M
  • Block Organization
    Symmetrical
  • Timing Type
    Synchronous
  • Interface Type
    Serial (SPI, Dual SPI, Quad SPI)
  • Minimum Operating Supply Voltage (V)
    2.7
  • Typical Operating Supply Voltage (V)
    3|3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Mounting
    Surface Mount
  • Package Height
    0.73
  • Package Width
    8
  • Package Length
    6
  • PCB changed
    8
  • Supplier Package
    WSON EP
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Pin Count

    a count of all of the component leads (or pins)

    8
  • Architecture
    Sectored
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