Winbond Electronics Corporation W74M32FVSSIQ/REEL

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

Automotive

No

PPAP

No

Chip Density (bit)

32M

Block Organization

Symmetrical

Number of Bits/Word (bit)

8

Number of Words

4M

Programmability

Yes

Timing Type

Synchronous

Max. Access Time (ns)

7

Interface Type

Serial (SPI, Dual SPI, Quad SPI)

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

30

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

Yes

ECC Support

No

Support of Page Mode

No

Minimum Endurance (Cycles)

100000

Mounting

Surface Mount

Package Height

1.8

Package Width

5.28

Package Length

5.28

PCB changed

8

Standard Package Name

SOP

Supplier Package

SOIC

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

8

Architecture

Sectored

Sector Size

4Kbyte x 1024

Page Size

256byte

Boot Block

No