Winbond Electronics Corporation W74M25FVZEIQ

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

HTS

8542.32.00.71

Automotive

No

PPAP

No

Chip Density (bit)

256M

Block Organization

Symmetrical

Number of Bits/Word (bit)

8

Number of Words

32M

Programmability

Yes

Timing Type

Synchronous

Max. Access Time (ns)

7

Interface Type

Serial (SPI, Dual SPI, Quad SPI)

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

30

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

Yes

ECC Support

No

Support of Page Mode

No

Minimum Endurance (Cycles)

100000

Mounting

Surface Mount

Package Height

0.73

Package Width

8

Package Length

6

PCB changed

8

Supplier Package

WSON EP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Pin Count

a count of all of the component leads (or pins)

8

Architecture

Sectored

Sector Size

4Kbyte x 8192

Page Size

256byte

Boot Block

No