Winbond Electronics Corporation W25Q32JVXGIM/REEL

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

Automotive

No

PPAP

No

Cell Type

NOR

Chip Density (bit)

32M

Block Organization

Symmetrical

Location of Boot Block

Bottom|Top

Address Bus Width (bit)

24

Number of Bits/Word (bit)

8

Number of Words

4M

Programmability

Yes

Timing Type

Synchronous

Max. Access Time (ns)

6

Maximum Erase Time (S)

50/Chip

Maximum Programming Time (ms)

3/Page

Interface Type

Serial (SPI, Dual SPI, Quad SPI)

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

25

Program Current (mA)

25

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

Yes

ECC Support

No

Support of Page Mode

No

Minimum Endurance (Cycles)

100000

Mounting

Surface Mount

Package Height

0.43

Package Width

4

Package Length

4

PCB changed

8

Supplier Package

XSON EP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

8

Architecture

Sectored

Sector Size

4Kbyte x 1024

Page Size

256byte

Boot Block

Yes