Winbond Electronics Corporation W29N08GVBIAA

Mounting Type

Surface Mount

Package / Case

63-VFBGA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

63-VFBGA (9x11)

Number of Terminals

63

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

HTS

8542.32.00.71

Automotive

Yes

PPAP

Unknown

Cell Type

SLC NAND

Chip Density (bit)

8G

Block Organization

Symmetrical

Address Bus Width (bit)

31

Number of Bits/Word (bit)

8

Number of Words

1G

Programmability

Yes

Timing Type

Asynchronous

Maximum Erase Time (S)

0.01/Block

Maximum Programming Time (ms)

0.7/Page

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

35

Program Current (mA)

35

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

No

ECC Support

Yes

Support of Page Mode

Yes

Minimum Endurance (Cycles)

100000

Mounting

Surface Mount

Package Height

0.6(Max)

Package Width

9

Package Length

11

PCB changed

63

Standard Package Name

BGA

Supplier Package

VFBGA

Lead Shape

Ball

Supply Voltage-Nom (Vsup)

2.7V - 3.6V

Package

Tray

Base Product Number

W29N08

Mfr

Winbond Electronics

Product Status

Active

Memory Types

Non-Volatile

Package Description

VFBGA,

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Number of Words Code

1000000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

W29N08GVBIAA

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

Winbond Electronics Corp

Part Life Cycle Code

Active

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Risk Rank

2.31

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 85°C (TA)

Series

-

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

SLC NAND Flash

Technology

FLASH - NAND (SLC)

Voltage - Supply

2.7V ~ 3.6V

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

63

JESD-30 Code

R-PBGA-B63

Supply Voltage-Max (Vsup)

3.6 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Voltage-Min (Vsup)

2.7 V

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

8Gbit

Speed

40MHz

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ASYNCHRONOUS

Clock Frequency

40 MHz

Access Time

25 ns

Memory Format

FLASH

Memory Interface

An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

Parallel

Architecture

Sectored

Organization

High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set

Seated Height-Max

1 mm

Memory Width

8

Write Cycle Time - Word, Page

25ns

Memory Density

8Gb

Parallel/Serial

PARALLEL

Memory IC Type

FLASH

Programming Voltage

A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

3 V

Sector Size

128Kbyte x 8192

Page Size

2Kbyte

Boot Block

No

Temperature

-40ºC ~ 85ºC / -40ºC ~ 105ºC

Memory Organization

1G x 8

Width

9 mm

Length

11 mm